Chemtronics Soder-Wick Unfluxed Desoldering Wick
Soder-Wick brand desoldering wick offers the state of the art in desoldering technology. Soder-Wick is designed for todays heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. All wick is sealed in nitrogen-purged packaging to avoid corrosion and loss of performance from moisture and oxygen.25 bobbins inresealable pouch
Key Features:
- Can be coated with any flux type
- Allows for a constant flux type throughout the production process
- Provides quick and safe desoldering
- 10' spools packaged in ESD-safe static dissipative bobbins
Typical Applications:
- Use with your specified flux type throughout the production process
- Thru-hole Components
- SMT Pads and BGA Pads
- Micro Circuits
- Terminals
- Lugs and Posts
Product Key Properties: Soder-Wick Unfluxed is ideal with a specific flux is required, like an aqueous flux. Note: braid will not remove solder with adding flux
Product Performance Benefits:Soder-Wick desoldering braid safely removes solderStatic Dissipative Packaging Soder-Wick is packaged on Static Dissipative bobbins in 5 and 10-foot lengths to minimize the risk of damage associated with static electricity. The static dissipative bobbins qualify as electrostatic discharge protective per MIL-STD-1686C and MIL-HDBK-263B, and meet the static delay rate provision of MIL-B-81705C.