Chemtronics Soder-Wick Lead-Free Desoldering Wick
Chemtronics Soder-Wick Lead-Free desoldering wick is the state of the art in desoldering technology. It is specially designed for removal of todays high-temperature lead-free solders. The single layer weave used for Soder-Wick Lead-Free desoldering wick is lighter in mass than any other desoldering wick available and allows for lead-free solder removal at lower temperatures. Soder-Wick Lead-Free desoldering wick responds faster than any other conventional desoldering braid. This unique design minimizes overheating and requires less contact time thus preventing heat damage to the PCB and sensitive components. For Lead-Free rework, Soder-Wick has the answer.
To use, select a wick width matching the pad or connection size. Position the wick on the solder joint, then place a hot soldering iron tip (600-750°F) on the wick. As the solder melts, the wick's color will transition from copper to silver. Simultaneously remove the wick and iron once the color change ceases, leaving a clean, solder-free component lead or pad. Clip off and discard the used wick portion. If necessary, clean the PCB with CircuitWorks Lead-Free Flux Remover Pen CW9400 and ControlWipes.
Key Features:
- Engineered specifically for high temperature, lead-free solders
- Transfers heat to the solder joint more quickly and efficiently than conventional desoldering braids
- Can also be used with Tin/Lead solders
- Non-corrosive ultra high purity no-clean flux
- Will not leave ionic contamination on the boards
- RoHS Compliant
- Static Dissipative Packaging
Typical Applications:
- Thru-hole Components
- SMT Pads and BGA Pads
- Micro Circuits
- Terminals, Lugs and Posts
Product Key Properties: High-Temperature No Clean Type ROL0. Specifications: ANSI/IPC J STD-004, MIL-F-14256 F. No Clean Flux Spec: MIL-STD-883B Bellcore TR-NWT-000078, ANSI/IPC J SF818. Shelf Life: 2 years. RoHS Compliant
Product Performance Benefits: Fastest wicking and heat transfer High capacity for solder uptake Halide free, no corrosive residues Minimizes risk of heat damage to pads, components and PBCs Can be used with Tin/Lead solders RoHS compliant