Chemask NA Non-Ammoniated Solder Mask
Chemask NA Non-Ammoniated Solder Masking Agent is a latex and ammonia free, fast curing, peelable temporary spot mask formulated for safe use on sensitive metals. It contains high-temperature resistant compounds that protect component-free areas during wave soldering. Chemask NA may be used to protect pins, posts, contacts and edge connections in the solder reflow oven or during conformal coating processes.
Engineered for use with bare copper, silver, and other reactive metals Ideal for SMT applications.
Key Features:
- Will not affect gold, copper, nickel, silver and OSP finishes
- For lead-free or tin/lead processes
- Stable to 550 F (288C)
- Phthalate-free, low toxicity and environmentally safe
- Compatible with rosin, no-clean and water soluble flux types
- Dries tack free in 15 minutes
- Can be placed directly into pre-heat oven without waiting
- Removes easily and leaves no residue
- Non-contaminating, non-staining and noncorrosive
- RoHS compliant
Typical Applications:
- Component-free areas during wave and reflow soldering
- Components and pin connectors
- Temperature sensitive components during wave or reflow soldering
Product Key Properties: High temperature, peelable, temporary mask safe for use on sensitive metals; Base Material: Synthetic Resin; Color: Green; Odor: Odorless; Flash Point: Nonflammable; Shelf life: 2 years; RoHS Compliant: Yes
Product Performance Benefits: Stable to 550F (288C); For lead-free or tin/lead processes; Phthalate-free, low toxicity and environmentally safe; Compatible with rosin, water soluble fluxes and cleaning solvents; Dries tack free in 15 minutes; Goes straight into the pre-heat oven; Removes easily and leaves no residue; Non-contaminating, non-staining and non-corrosive; Compatible with gold, copper, nickel, silver and OSP finishes.