Chemtronics CircuitWorks Thermal Paste
CircuitWorks Thermal Paste facilitates heat transfer away from electrical/electronic components. This heavy consistency material is thickened with a heat conductive filler to maintain a positive heat sink seal in electrical/electronic equipment.
Key Features:
- Facilitates heat transfer between circuit components and heat sinks
- Excellent thermal and dielectric properties
- Will not dry out, harden, or melt
- Noncorrosive and nonflammable
Typical Applications:
- Effective thermal coupler for any heat sink device
- Nonflammable coating protection
- High voltage corona protection
- Excellent for improving readings on contact type thermocouples
Product Key Properties:
- Heat Sink Grease (CT40-5): Silicone-based, thermally stable from -40°F (-40°C) to 392°F (200°C), meets MIL-DTL-47113D Type I.
- Silicone Free Thermal Paste (CW7270): Silicone-free compound avoids silicone migration, thermally stable from -99.4°F (-73°C) to 392°F (200°C), exceeds MIL-C-47113 for thermal conductivity.
- Boron Nitride Thermal Paste (CW7250, CW7250KG): Provides maximum thermal conductivity with superior dielectric properties, silicone-free compound will not harden or dry out, thermally stable from -99°F (-73°C) to 392°F (200°C), exceeds MIL-C-47113 for Thermal Conductivity.
Product Performance Benefits:
- Facilitates heat transfer between circuit components and heat sinks
- Excellent thermal and dielectric properties
- Will not dry out, harden, or melt
- Noncorrosive and nonflammable