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Part Number: DOWSIL-TC-6040

DOWSIL TC 6040 THERMAL CONDUCTIVE - ENCAPSULANT

Unit of Measure: EA

Minimum Order Qty: 1

Manufacturer: Dow

Usually Ships: REQUEST

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Features and Specifications

DOWSIL TC 6040 Thermal Conductive Encapsulant – A two part, flowable silicone encapsulant designed for thermal management applications, offering room temperature cure and heat accelerated options.

DOWSIL TC 6040 is a versatile, two part silicone encapsulant engineered for effective thermal management in a variety of electronic and power systems. Its flowable nature allows for easy filling of complex geometries, while the self leveling properties minimize void formation. The encapsulant cures at room temperature, providing flexibility in processing, and can be heat accelerated for faster production cycles. The material demonstrates excellent stability across a wide temperature range, maintaining performance from 45°C to +150°C during long term exposure and up to +200°C for shorter periods.

Mixing is straightforward, requiring a 1:1 ratio by weight or volume. A static mixer is recommended for both manual and automated applications to ensure thorough mixing and prevent light colored streaks. De airing may be beneficial to further reduce voids. The encapsulant exhibits a controlled volatility and minimal filler settling, contributing to consistent performance and simplified processing.

Key Features:
• Two part, flowable silicone formulation
• Room temperature cure with heat accelerated option
• High flow and self leveling characteristics
• Minimal filler settling
• Wide operating temperature range ( 45°C to +150°C, up to +200°C for short durations)
• Easy to mix and process

Typical Applications:
• Lighting assemblies
• EV controllers
• On board chargers
• Energy conversion systems
• Electronic module assemblies
• Inverters/converters
• Control units
• Power supplies & modules Uses Heat dissipation
Protection
Stress relief
Thermal interface material (TIM) Thermal conductivity: 4.0 W/mK
Room temperature or heat accelerated cure
Cure time: 24 hr at 25 °C, 60 min at 100 °C
Hardness: 32 Shore A
Low viscosity for good flowability and impregnation
Reduced filler caking and easy rehomogenization
Good high temperature stability up to 175 °C
Low volatile content (D4 D10) < 200ppm
UL 94 V0 Mixing Ratio: 1:1 wt%
Color: Pink
Cure Type: Heat accelerated cure, Room temperature cure
Durometer Shore A: 32
Elongation: 10 %
Heat Cure: 60 min @ 100 °C
Material Type: Encapsulant / Pottant
Number of Parts: 2 part
Specific Gravity: 3.1
Tensile Strength in MPa: 0.3 MPa
Thermal Conductivity: 4 W/mK
Unprimed Adhesion Lap Shear: 0.10 MPa

Color: PINK

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Part Number: DOWSIL-TC-6040

DOWSIL TC 6040 THERMAL CONDUCTIVE - ENCAPSULANT

Features and Specifications

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