DOWSILEE320025KG | DOWSIL EE 3200 LOW STRESS SILICONE ENCAPSULANT - 25KG | Aircraft products | na

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Part Number: DOWSIL-EE-3200-25KG

DOWSIL EE 3200 LOW STRESS SILICONE ENCAPSULANT - 25KG

Size: 25KG

Unit of Measure: EA

Minimum Order Qty: 1

Manufacturer: Dow

Usually Ships: REQUEST

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Features and Specifications

DOWSIL EE 3200 Low Stress Silicone Encapsulant – Two part, low viscosity encapsulant minimizing internal stress and improving manufacturing speed for high volume devices.

DOWSIL EE 3200 is a two part, low viscosity silicone encapsulant designed for high volume applications where minimizing internal stress generation is critical. Its 1:1 mix ratio allows for easy handling, and curing can be achieved at room temperature or accelerated with heat. The cured encapsulant exhibits a soft, low durometer consistency, offering good thermal conductivity and heat dissipation capabilities. This combination of properties makes it ideal for protecting sensitive components in demanding environments.

The encapsulant's excellent electrical insulation properties and resistance to water ingress ensure safety and reliability, particularly in harsh outdoor conditions. The product is approved to railway standard EN45545 2: R22/R23/R24/R25/R26 – HL3. Proper processing involves thorough mixing of the two components, followed by pouring or dispensing, ideally under vacuum to minimize air entrapment. Adhesive applications require a primer for optimal bonding.

Key Features:
• Low viscosity for easy processing
• Low stress formulation to protect components
• Good thermal conductivity and heat dissipation
• Excellent electrical insulation
• Water ingress prevention
• Room temperature or heat curing options
• Approved to railway standard EN45545 2: R22/R23/R24/R25/R26 – HL3

Typical Applications:
• High volume device encapsulation
• Filling small gaps
• Protection of sensitive components in harsh environments
• Applications requiring good thermal management
• Railway applications Uses Desined for protection of Power Conversion Devices (Inverters, Converters), Junction Boxes, Automotive PCB Modules, Railways PCB Systems Low modulus reduces pressure on components
Thermal conductivity effectively dissipates heat
Good mechanical adhesion avoids delamination issues
Fast cure and optimized working time allows for more complex designs and lower module cost
Dielectric strength and volume resistivity reduce costs as no additional dielectric barrier is required
Ease of use low viscosity allows fast fill and fit with high throughput manufacturing processes
Minimal filler settling allows for ease of process control
Meets certification requirements Use: Boards and Assemblies, Components
Regulatory Approvals: UL Recognized
Number of Parts: Two Part
Room Temperature Cure: 3 Hours
Working Time at 25 °C: 30 Minutes
Color: Dark Grey to Black
Cure Type: Heat Cure, Room Temperature Cure
Dielectric Strength: 350 volts per mil v/mil
Durometer Shore 00: 21
Heat Cure: 20 min @ 50 °C
Opacity: Opaque
Specific Gravity @ 25 °C: 1.48
Thermal Conductivity: 0.50 W/mK
Viscosity: 1700 mPa.s

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Part Number: DOWSIL-EE-3200-25KG

DOWSIL EE 3200 LOW STRESS SILICONE ENCAPSULANT - 25KG

Features and Specifications

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