DOWSILTC5515 | DOWSIL TC 5515 LT LOW DENSITY THERMAL CONDUCTIVE GAP - FILLER | Aircraft products | na

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Part Number: DOWSIL-TC-5515

DOWSIL TC 5515 LT LOW DENSITY THERMAL CONDUCTIVE GAP - FILLER

Unit of Measure: EA

Minimum Order Qty: 1

Manufacturer: Dow

Usually Ships: REQUEST

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Features and Specifications

DOWSIL TC 5515 LT Low Density Thermal Conductive Gap Filler – Two part silicone gap filler for heat dissipation in electronic and EV applications, offering room temperature or accelerated curing and excellent stress relief.

DOWSIL TC 5515 LT is a two part, 2.0 W/m K thermally conductive silicone gap filler designed for heat dissipation from electronic devices, electric vehicle (EV) modules, and other heat generating components. It features room temperature curing with an optional accelerated heat cure, resulting in a soft, compliant elastomer that effectively reduces stress in vibrating applications. The cured material remains in its applied position and exhibits a tacky surface, simplifying rework after curing and assembly.

The product is easily dispensed using a static mixer, which is recommended for both manual and automated processes. Mixing the two components in the correct ratio (by weight or volume) yields a mixture that cures without an exothermic reaction at a consistent rate regardless of thickness or confinement. No post cure is needed; the gap filler can be immediately put into service within an operating temperature range of 45°C to 150°C. The cured material is non flowable on both flat and vertical surfaces.

Key Features:
• 2.0 W/m K thermal conductivity
• Room temperature cure with accelerated heat cure option
• Soft, compliant cured material for stress relief
• Tacky cured surface for easy rework
• Non flowable in flat and vertical positions
• Specific gravity (cured): 1.95
• Operating temperature range: 45°C to 150°C
• UL 94 V0 recognition

Typical Applications:
• Heat dissipation from electronic devices
• Heat dissipation from EV modules
• Gap filling in heat generating components Uses Heat dissipation
Vibration damping
Stress relief
Thermal interface material (TIM) Thermal conductivity: 2.0 W/mK
Room temperature or heat accelerated cure
Cure time: 6 hr at 25 °C, 30 min at 80 °C
Hardness: 65 Shore 00
Specific Gravity: 1.95
Easy to rework after curing and assembly
Soft, compliant, and stress relieving Mixing Ratio: 1:1 wt%
Room Temperature Cure: 6 Hours
Color: Blue
Cure Type: Heat accelerated cure, Room temperature cure
Durometer Shore 00: 65
Heat Cure: 30 min @ 80 °C
Material Type: Gap Filler
Number of Parts: 2 part
Specific Gravity: 2
Thermal Conductivity: 2 W/mK

Color: WHITE/BLUE

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Part Number: DOWSIL-TC-5515

DOWSIL TC 5515 LT LOW DENSITY THERMAL CONDUCTIVE GAP - FILLER

Features and Specifications

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