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Part Number: DOWSIL-EG-3810-18KG

DOWSIL EG 3810 DIELECTRIC GEL - 18KG

Size: 18KG

Unit of Measure: EA

Minimum Order Qty: 1

Manufacturer: Dow

Usually Ships: REQUEST

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Features and Specifications

DOWSIL EG 3810 Dielectric Gel – One part, low to high temperature silicone gel for potting and protecting PCB assemblies, offering dielectric insulation and environmental protection.

DOWSIL EG 3810 Dielectric Gel is a single component silicone gel designed for potting and protecting printed circuit board (PCB) system assemblies, particularly power semiconductor modules. It effectively protects delicate dies and interconnects from various environmental factors while providing reliable dielectric insulation. This gel maintains stable performance across a wide temperature range, extendingn to 60°C, and its flexible nature helps accommodate coefficient of thermal expansion (CTE) mismatches between different components within the assembly.

Application is straightforward, allowing for both manual dispensing and automated application via meter mix equipment. While typically exhibiting good void free properties, degassing under vacuum (above 28 inches Hg) may be necessary for optimal protection. The gel's working time is defined as the time it takes for its initial viscosity to double at room temperature. Curing conditions are detailed in the product's properties table, though additional time should be factored in for oven heating. While the gel functions over a wide temperature range ( 60°C to 200°C), users should verify performance at temperature extremes. Note that certain materials may interfere with the curing process. Rework and salvage are facilitated through the use of OS Fluids or a soldering iron, followed by cleaning and patching with additional silicone gel. Consult the product and safety data sheets prior to handling.

Key Features:
• One part, easy to dispense formulation
• Wide operating temperature range ( 60°C to 200°C)
• Protects against environmental conditions
• Provides dielectric insulation
• Accommodates CTE mismatch between components
• Allows for salvage and rework

Typical Applications:
• Potting and protecting PCB assemblies
• Protecting power semiconductor modules
• Die and interconnect protection Uses Potting and protecting of PCB system assemblies, especially power semiconductor modules. Clear
Heat cure gel
Suitable for operating temperatures ranging from 60 °C to +200 °C
No mixing required Use: Boards and Assemblies, Components
Number of Parts: One Part No Mixing
Color: Clear
Cure Type: Heat Cure
Dielectric Constant at 100 kHz: 2.90
Dielectric Strength: 533 volts per mil v/mil
Heat Cure: 15 min @ 125 °C, 10 min @ 150 °C
Opacity: Transparent
Penetration after cure: 80
Specific Gravity @ 25 °C: 0.97
Thermal Conductivity: 0.15 W/mK
Viscosity: 690 mPa.s

Color: CLEAR/COLORLESS

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Part Number: DOWSIL-EG-3810-18KG

DOWSIL EG 3810 DIELECTRIC GEL - 18KG

Features and Specifications

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