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Part Number: DOWSIL-3-6635-18.1KG

DOWSIL 3 6635 DIELECTRIC GEL - 18.1KG

Size: 18.1KG

Unit of Measure: EA

Minimum Order Qty: 1

Manufacturer: Dow

Usually Ships: REQUEST

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Features and Specifications

DOWSIL 3 6635 Dielectric Gel – One part, low temperature curable dielectric gel for flexible, cushioning, and self healing applications in electronics.

DOWSIL 3 6635 Dielectric Gel is a single component, low temperature curing gel designed for use in applications operating between 80°C and 200°C ( 112°F and 392°F). Its low viscosity ensures easy flow and complete coverage, ideal for filling voids and providing a protective layer under components. The gel's flexibility helps mitigate stress caused by coefficient of thermal expansion (CTE) mismatches between materials at very low temperatures, and it cures in place to provide both cushioning and dimensional stability. The one part formulation simplifies application and reduces waste compared to two part systems.

This product is compatible with both manual and automated application methods. While typically heat cured, optimal cure schedules should be determined for each specific application. To minimize voids, degassing under vacuum (above 28 inches Hg) may be necessary. The product's low viscosity and one part nature contributes to reduced processing errors.

Key Features:
• One part formulation for ease of use and reduced waste
• Low viscosity for easy flow and complete coverage
• Flexible and cushioning at very low temperatures ( 80°C)
• Heat cured for dimensional stability
• Compatible with manual and automated application equipment
• Self healing properties

Typical Applications:
• Void filling in electronic assemblies
• Component cushioning and protection
• Stress relief in applications with CTE mismatch
• PCB system assemblies operating at extreme temperatures Uses Suitable for potting and protecting of PCB system assemblies 1 part gel with no mixing required
Heat cure
Suitable for very low temperatures ( 80 to 200 °C / 112 to 392 °F)
Less waste and potential for error with a 1 part material
Gel remains flexible in very low temperature applications
Low viscosity allows good flow under components Use: Boards and Assemblies
Regulatory Approvals: UL Recognized
Cure Type: Addition Cure
Number of Parts: One Part No Mixing
Color: Clear
Cure Type: Heat Cure
Dielectric Constant at 100 kHz: 2.84
Dielectric Strength: 525 volts per mil v/mil
Heat Cure: 48 min @ 100 °C, 6.6 min @ 125 °C, 6.4 min @ 150 °C
Opacity: Transparent
Penetration after cure: 85
Specific Gravity @ 25 °C: 1
Thermal Conductivity: 0.20 W/mK
Viscosity: 700 mPa.s

Color: CLEAR

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Part Number: DOWSIL-3-6635-18.1KG

DOWSIL 3 6635 DIELECTRIC GEL - 18.1KG

Features and Specifications

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