LOCTITEABLESTIKICP392010CC | LOCTITE ABLESTIK ICP 3920-CONDUCTIVE ADHESIVE FOR ELECTRONICS - 10CC | Aircraft product | LOCTITEABLESTIK

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Part Number: LOCTITE-ABLESTIK-ICP-3920-10CC

LOCTITE ABLESTIK ICP 3920-CONDUCTIVE ADHESIVE FOR ELECTRONICS - 10CC

Size: 10CC

Unit of Measure: EA

Minimum Order Qty: 1

Manufacturer: LOCTITE/ABLESTIK

Usually Ships: REQUEST

Features and Specifications

LOCTITE ABLESTIK ICP 3920 – Electrically conductive adhesive for SMD interconnections

LOCTITE ABLESTIK ICP 3920 is a silver, electrically conductive die-attach adhesive designed for dispensing, printing, and surface-mount technology (SMT) assembly. This low-viscosity, low-CTE, lead-free adhesive offers a long work life, minimizing waste and cleanup time. Formulated with an epoxy-based resin, it cures rapidly with heat and requires no post-cure. An improvement over ABLESTIK CE 3920, ICP 3920 is compatible with finer dispensing needles without clogging.

Key Features:
• Lead-free
• Long work life
• No post-cure required
• Thermosetting
• Low viscosity and low CTE
• Two-part adhesive
• Dispensable via dispense gun

Typical Applications:
• Surface Mount Technology (SMT) assembly
• Die-attach applications

Technical Specifications:
• Product category: Electrically conductive adhesives
• Technologies: Thermosets, electronics assembly materials
• Application method: Dispense gun
• Cure schedule (@ 110.0 °C): 60.0 min.
• Cure type: Heat cure
• Number of components: 2 part
• Operating temperature: -45.0 °C - 150.0 °C
• Shear strength: 1310.0 psi
• Storage temperature: 0.0 °C - 8.0 °C
• Thixotropic index: 5.7
• Viscosity, cone & plate, Angle 3°, Speed 5 rpm: 26100.0 mPa·s (cP)
• Volume resistivity: 0.0003 Ohm cm A 1-part, low-temperature curing, electrically conductive die-attach adhesive designed for SMD interconnect formation and stencil/screen printing. Electrically conductive adhesive for SMD interconnections LOCTITE ABLESTIK ICP 3920 is a silver, electrically conductive die-attach adhesive for dispense or printing applications and surface-mount technology (SMT) assembly processes. It’s a low-viscosity, low-CTE and Pb-free alternative to solder with a long work life for minimal product waste and clean-up time. It’s formulated with an epoxy-based resin, cures fast when exposed to heat and doesn’t require any post-cure. LOCTITE ABLESTIK ICP 3920 is an improved version of ABLESTIK CE 3920 and can be used with finer dispensing needles without clogging.
Pb-free
Offers a long work life
No post-cure required
Thermosetting
Low viscosity and low CTE Product Category: Electrically conductive adhesives
Technologies: Thermosets, electronics assembly materials
Application Method: Dispense gun
Cure Schedule, @ 110.0 °C: 60.0 min.
Cure Type: Heat cure
Number of Components: 2 part
Operating Temperature: -45.0 °C - 150.0 °C
Shear Strength: 1310.0 psi
Storage Temperature: 0.0 °C - 8.0 °C
Thixotropic Index: 5.7
Viscosity, Cone & Plate, Angle 3°, Speed 5 rpm: 26100.0 mPa·s (cP)
Volume Resistivity: 0.0003 Ohm cm

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Part Number: LOCTITE-ABLESTIK-ICP-3920-10CC

LOCTITE ABLESTIK ICP 3920-CONDUCTIVE ADHESIVE FOR ELECTRONICS - 10CC

Features and Specifications

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