COMPONENT BONDING: Provides strong adhesion and environmental resistance for critical components like antennas, speakers, magnets, and camera modules
DESIGN FLEXIBILITY: Enables the creation of stiffer and thinner designs, maximizing internal space for components
DIMENSIONAL STABILITY: Offers flexural strength, providing OEMs with a compelling assurance of its resilience against bending forces
IMPACT RESISTANCE: Designed to withstand greater shear impact forces, a crucial attribute for enhancing smartphone durability against drops
INNOVATIVE ENGINEERING: A high modulus acrylic foam tape between two PET release liners that bonds to a wide range of high and medium-surface energy materials
REDUCED TENSILE CREEP: With high cohesive strength, there is 60% greater creep resistance than 4914 and 80% greater creep resistance than 86420, helping the device retains its shape and functionality over time
THICKNESS: Comes in a gray, 150 µm thick form factor
VERSATILE APPLICATIONS: Suitable for display and back cover bonding, helping screen stability and protection from impacts