Additional Description:
TESA HEAT ACTIVATED FILM
Adhesive:
Phenolic Resin
Tape Type:
tesa HAF 8410 is especially designed for the embedding of chip-modules into smart cards. It is also suitable for bonding of all thermal resistant materials such as metal, glass, plastic, wood and textiles (e.g. friction liners for clutches).
Thickness:
2.4 mils