CORFIL® 615 potting compound is a low-density compound for use as insert or edge filling material in honeycomb sandwich construction. After the curing agent is added, CORFIL 615 remains a thick paste that will not run of its own weight when placed in the desired construction.
This thixotropic property is highly convenient because it eliminates the need for molds or other containing devices during the curing period. After CORFIL 615 is cured, it will withstand subsequent temperatures up to 350°F (177°C) without becoming fluid or otherwise impairing its use as a structural material. Three curing agents can cure the potting compound to a hard, rigid material. These are Curing Agent “Z” for curing at elevated temperature; Curing Agent “A” for curing at 120°F (49°C); and Curing Agent “DTA” for curing at ambient temperature.