BOND SMALL COMPONENTS: Ideal for applications involving electronic components like displays, frames, speakers, and wearables
BONDING, REIMAGINED: Offers easier application compared to liquid adhesives while activating with light, rather than heat
CURING TIME: Achieves immediate green strength and full bond strength at room temperature within 24 hours following UV activation
ENHANCED PERFORMANCE: Delivers good impact resistance and high bond strength with good reworkability
FAMILIAR FEEL: Processes and performs like a pressure-sensitive adhesive (PSA) before UV activation, including the ability to die cut for precision bonding
MIDDLE CARRIER FILM: Features a middle carrier film for easy converting and application before curing
THICKNESS: This tape has a thickness of 300 µm
VARIOUS SUBSTRATES: Bonds opaque and transparent substrates, creating excellent bond strength on most medium and high surface energy materials