בס״ד
Product Index
Specification Index
Manufacturer Index
Submit RFQ
Contact Us
Millions of Consumable Products for the Aerospace Industry
Paste List
Aircraft Products
Cable
Chocks
Cordage
Electronics
Extrusions
Fasteners
Ground Maintenance
Protection
Tapes
Thread
Tubing
Webbing
Raw Materials
Cable
Fabrics
Lock Wire
Metals
Paper
Plastics
Metals
Wire
Wood
Maintenance Supplies
Bearings
Foreign Object Debris
Ground Support Equipment
Industrial
Maintenance Repair & Overhaul
Paint
Sleeves
Seals
Tools
Chemicals and Consumables
Adhesives
Chemicals
Cleaners
Corrosion Inhibitors
Grease
Lubricants
Paints & Coatings
Primers
Resins
Sealants
Services
Tape Slitting & Converting
Home
/ 00051111909232
3M Polyester Delaminating Tape 3305, 310 mm x 100 m, 1 Roll/Case
Part Number:
00051111909232
View more details
Product Specifications
Size
310 mm x 100 m
Unit of Measure
RO
Sold As
Case
Minimum Order Qty
2 RO
Incremental Order Qty
1 RO
Stock Type
Make To Order
Shelf Life
730 Days
Catalog #
3305
Manufacturer ID
7100223141
UPC
00051111909232
ECCN
EAR99
Manufacturer
3M
View all 2 options
in
3M Polyester Delaminating Tape 3305
Other Options at this size & color
310 mm x 100 m · 1 Case
$562.86 / RO
3M Polyester Delaminating Tape 3305, 310 mm x 100 m, 1 Roll/Case
Currently viewing
Other sizes & options
50 mm x 100 m PL(20) EXP
$88.14 / RO
3M Polyester Delaminating Tape 3305, 50 mm x 100 m PL(20) EXP
Details
Highlights
Enables simple, low-stress, room temperature peeling of 3M Adhesives from thinned silicon wafers after glass carrier debonding
Good holding power
High instant adhesion to substrate
Transparency allows for inspection without tape removal
3M Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.A transparent polyester film tape with an agressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.