3M Trizact Pad Conditioner delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP). The diamond-coated ceramic construction on 3M Trizact Pad Conditioner is ideal for manufacturing to micro-scale specifications, as well as exceptionally smooth pad surface finishes without tiny scratches commonly caused by diamond grit abrasives. It has a metal-free cutting surface for advanced node processes sensitive to metal contamination. It can also be combined with 3M CMP Pad Conditioner Coatings to help reduce metal leaching by up to an additional 99% while maintaining flatness, aggressiveness and polishing performance.