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/ 00051141415277
3M Wafer De-Taping Tape 3305, 210 mm x 100 m, 4/Case
Part Number:
00051141415277
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Product Specifications
Size
210 mm x 100 m
Unit of Measure
RO
Sold As
Case
Minimum Order Qty
4 RO
Incremental Order Qty
4 RO
Package Quantity
4 Rolls per Case
Stock Type
Make To Order
Shelf Life
730 Days
Catalog #
3305
Manufacturer ID
7100079058
UPC
00051141415277
ECCN
EAR99
Manufacturer
3M
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3M Wafer De-Taping Tape 3305
Other Options at this size & color
210 mm x 100 m · 4 Case
$337.89 / RO
3M Wafer De-Taping Tape 3305, 210 mm x 100 m, 4/Case
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Other sizes & options
25 mm x 100 m
$44.07 / RO
3M Wafer De-Taping Tape 3305, 25 mm x 100 m
Details
Highlights
Enables simple, low-stress, room temperature peeling of 3M Adhesives from thinned silicon wafers after glass carrier debonding
Good holding power
High instant adhesion to substrate
Transparency allows for inspection without tape removal
3M Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.A transparent polyester film tape with an agressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.