Embossed backing cuts through the layer of adhesive for establishing contact between the backing and the application substrate
Embossed, copper foil backing resists discoloration and oxidation
Flame-retardant and suitable for grounding and EMI shielding in equipment, components and shielded rooms
Offers outstanding solderability with tin-plated coating
Offers stable contact resistance and good shielding effectiveness
Rated for 600V applications
UL Listed and RoHS 2011/65/EU Compliant
Withstands a wide temperature range of -40 to 266 °F (-40 to 130 °C)