Adhesion to select low-surface-energy substrates
Conformable for precise placement in tight spaces to create EMI-sealed bond lines
Excellent EMI shielding in bond line gap
Excellent EMI shielding performance for a wide range of frequencies
Excellent grounding with small contact areas for microelectronics
Four-year shelf life for reliable, consistent performance over time
Halogen free* and RoHS compliant**
Isotropic XYZ-axis conductivity through the adhesive
Long-term performance at high temperatures (105 °C) for demanding applications