Conformable for precise placement in tight spaces to create EMI-sealed bond lines
Excellent EMI shielding in bond line gap
Excellent grounding with small contact areas for microelectronics
Four-year shelf life for reliable, consistent performance over time
Halogen free* and RoHS compliant**
High adhesion for reliable electrical contact to many substrates including select low-surface-energy substrates
Isotropic XYZ-axis conductivity through the adhesive
Long-term performance at high temperatures (105 °C) for demanding applications