BOND, DEBOND, AND BOND AGAIN: Rebondable up to three times, facilitating easy rework in factories and seamless integration into quality control processes
EASY TO REMOVE: Reduces 85% of the tensile strength force required to separate parts compared to traditional bonding methods
ENABLING RIGHT-TO-REPAIR: Designed for the age of "Right-to-Repair", helping to comply with evolving regulations around device repairability
FOR A VARIETY OF DEVICES: Overcomes many bonding challenges of device housings, displays, batteries, and other components in tablets, notebooks/PCs, speakers, smart home devices, and other various consumer electronics
LOW-VOLTAGE ACTIVATION: Releases in under 90 seconds using 9–30 V
MADE FOR CIRCULARITY: Helps to improve the recyclability of devices by enabling easy separation of materials at room temperature
THE FUTURE OF ADHESION: A 0.075 mm thin, single-layer pressure sensitive adhesive (PSA) that is electrically debondable