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3M Low-Static Polyimide Film Tape 7419, NSNF, 4 mm x 33 m, 124/Case

Part Number: 00068060478122 View more details
3M Low-Static Polyimide Film Tape 7419, NSNF, 4 mm x 33 m, 124/Case Image not available

Product Specifications

Size
4 mm x 33 m
Unit of Measure
RO
Minimum Order Qty
160 RO
Incremental Order Qty
160 RO
Stock Type
Make To Order
Shelf Life
547 Days
Catalog #
TBD
Manufacturer ID
7100387547
UPC
00068060478122
ECCN
EAR99
Manufacturer
3M
View all 7 options in 3M Low-Static Polyimide Film Tape 7419

Details

Highlights

High-temperature adhesive has excellent chemical resistance for demanding chemical masking applications
Maintains static dissipative properties to protect sensitive components
Offers clean removal from substrates like FR-4 and gold
Silicone-free acrylic adhesive is resistant to typical solder mask temperatures for short periods of time
Stays firmly in place during processing and removes cleanly from typical electronic substrates even after 10 minutes at 260°C (500°F)
Wound on a polyethylene tape core
3M Low-Static Polyimide Film Tape 7419 is a high-temperature tape for electronic applications. With a silicone-free adhesive, it withstands short-term exposure to typical solder mask temperatures and provides clean removal, helping minimize contamination risks.Delivering performance in electronics applications, 3M Low-Static Polyimide Film Tape 7419 is engineered for high-temperature conditions. This soldering masking tape features a specially formulated acrylic adhesive, helping ensure robust adhesion during short exposure to elevated solder mask temperatures while providing clean removal from common substrates such as FR-4, gold, and silicon. Its non-silicone adhesive composition helps reduce the risk of contamination, making it an ideal choice for powder coat masking tasks. The tape's low static dissipative properties allow for use in static-sensitive environments. Known for its high tensile strength, this tape performs in demanding chemical masking situations and offers a reliable, clean solution to help keep substrates safe from heat and chemical exposure during critical stages of electronic manufacturing processes.