Features and Specifications
Araldite 2014 structural adhesive. is a two component, room temperature curing, thixotropic paste adhesive of high strength with good environmental and excellent chemical resistance.
Used for bonding of metals, electronic components, GRP structures and many other items where a higher than normal temperature or more aggressive environment is to be encountered in service. The low out gassing makes this product suitable for specialist electronic
telecommunication and aerospace applications.High-viscosity epoxy with excellent chemical, heat and water resistance. Offers good lap shear strength at elevated temperatures after curing at 77°F (25°C). For metals, composite panels, ceramics and wood. Qualified to ABP2-3094.